Semiconductor Manufacturing
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Semiconductor
Manufacturing
International
Corporation
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Stock symbol: NYSE:SMI
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Average daily volume (recent
IPO):
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Stock price 3/17/04: $15.90
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Common shares (3/17): 364,000,000*
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52-week price range: recent IPO
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Equity market capitalization: $6
billion
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*ADS (American Depository Shares)
China-based semiconductor
company providing integrated wafer manufacturing services
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____________________________________________________________________
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Address: 18 Zhang
Jiang Road, Pudong New Area, Shanghai, F4, 201203, China
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Telephone:
86-21-5080-2000
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Web site: not
available
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State or other jurisdiction of incorporation
or organization: China
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Auditors: Deloitte
& Touche Tohmatsu
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Investor contact:
Jenny Wang, CFO
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_______________________________________________________________________
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Business (see glossary at the end)
. Fabricates semiconductors based on customers' own or third
parties’
integrated circuit designs
. Developed leading edge integrated wafer manufacturing services,
including
copper interconnects capabilities, within three years after founding in
April 2000
. One of the leading semiconductor foundries in the world
Industry trends
Compound annual growth rate
> The worldwide sales compound annual growth rate of the
semiconductor foundry industry
. Is projected to be 21.8% from 1998 to 2008
. Compared to 9.5% for the semiconductor industry as a whole for the
same period
according to IC Insights, a leading semiconductor industry publication
Semiconductor foundries are key partners to…
> Fabless semiconductor companies, which have expanded
geographic reach and worldwide sales
> Integrated device manufacturers, which have outsourced
manufacturing requirements for complex
semiconductor devices to become more cost competitive
Well positioned
SMI believes it is well positioned to benefit from
. Fabless semiconductor company growth and
. Integrated device manufacturer outsourcing
China emerges
> The China domestic market for electronic information
products in China
. Grew from US$20.2 billion in 1999 to US$77.1 billion in 2002
. According to China’s Ministry of Information Industry
> SMI believes its position as a leading foundry in China
. Allows it to meet Chinese semiconductor sourcing demand
. And to meet electronic products for export demand
Industry recognition
. SMI's Fab 1 facility in Shanghai was selected as one of the
two "Top Fabs of 2003" by
Semiconductor International, a leading industry publication.
. Ranked second in a readers’ poll of top global foundries of 2003
conducted by Silicon Strategies,
another leading semiconductor industry publication.
Current capacity
. SMI believes it is the only semiconductor foundry to have
reached capacity in excess of 40,000
8-inch wafers per month
. Had an aggregate capacity as of December 31, 2003 of 49,000 8-inch
wafers per month for wafer
fabrication and 9,000 wafers per month for copper interconnects
. Operates an 8-inch wafer fabrication facilities in the Zhangjiang
High-Tech Park in Shanghai,
China and, as a result of a recent (Motorola) acquisition, an 8-inch
wafer fab in Tianjin, China.
Capacity expansion
. Currently constructing 12-inch wafer fabrication facilities
in Beijing
. SMI believes it will be the first 12-inch fabrication facility in
China.
Manufacturing & service focus
Manufacturing
> Semiconductor fabrication services using 0.35
micron to 0.13 micron process technology for
. Logic technologies
(including standard logic, mixed-signal, radio frequency and high
voltage circuits)
. Memory technologies
(including dynamic random access memory, static random access memory,
flash, electronically
erasable programmable read-only memory and mask read-only memory)
. Specialty technologies
(including liquid crystal on silicon, complementary metal oxide silicon
image sensor and
system-on-chip)
Services
> In addition to wafer fabrication, SMI service offerings include
libraries and circuit design blocks,
design support, mask-making and wafer probing.
> Also works with partners to provide assembly and testing services.
Customers and concentration
Customers
. Integrated device manufacturers (IDMs): Fujitsu
Limited, Infineon Technologies AG, Samsung
Electronics., STMicroelectronics and Texas Instruments
. Fabless semiconductor companies: Broadcom, Elite Semiconductor Memory
Technology, Marvell
Semiconductor
(Note: customer list "is not intended to identify top customers, but
rather to provide a representative
sampling of SMI's customer base")
Customer concentration
. For the year ended December 31, 2003, SMI's five largest customers
accounted for 57^ of sales
. Sales are dependent upon a small number of customers
No backlog, high fixed
costs, cyclical business
No backlog
. Customers purchase orders are not placed very far in advance of
shipping dates
. Because expenses have high fixed cost components -- costs can't be
adjusted quickly to
compensate for shortfalls in sales
. The semiconductor manufacturing business is notoriously cyclical
Designed-in products result in
long sales cycle
. Sales cycle can last a year or more
. Sales cycles to IDM (integrated device manufacturers) customers can
take longer
Competition
Dedicated
foundry service providers
. SMI's competitors and potential competitors include TSMC, UMC and
Chartered Semiconductor.
(TSMC = Taiwan Semiconductor Manufacturing Company, UMC = United
Microelectronics Corp)
. TSMC, UMC and Chartered Semiconductor had market shares of 53%, 24%
and 7%, respectively,
in the semiconductor foundry industry in 2003, according to IC Insights
. Both TSMC and UMC have announced plans to build and acquire fabs in
mainland China in order
to compete for the growing domestic market in China.
Semiconductor companies --
Integrated Device Manufacturers (IDMs)
. IDMs that have established their own foundry capabilities.
. Include Fujitsu Limited, Hynix, IBM, Samsung Electronics Co., Ltd.
and Toshiba.
. IDMs are primarily dedicated to fabricating integrated circuits for
the end products of their
respective affiliates
Basis of competition
. Rather than competing solely on price, SMI intends to
compete on process technology,
performance, quality and service
. In more advanced technologies, the competition tends to be greater
Patent lawsuit
SMI is currently the subject of a lawsuit in the United States
brought by TSMC in December 2003
. Relating to alleged infringement of five U.S. patents and
. Misappropriation of alleged technical and operational trade secrets
relating to methods for
conducting semiconductor fab operations and manufacturing integrated
circuits.
Exchange rate risk
> SMI financial statements are prepared in U.S. dollars
. SMI sales are denominated in U.S. dollars
. Operating expenses & capital expenditures are denominated in U.S.
dollars, Japanese Yen, Euros
and Renminbi Yuan (conversion rate set by the People’s Bank of China)
> If the dollar falls against the other denominations, then costs
increase in US$ terms
> If China were to devalue its currency relative to the US dollar
. Then sales expressed in US$ would decline and SMI products would
become more expensive
(in terms of US$)
. The Chinese government remains under international pressure to allow
the Renminbi rate to float
Very
capital intensive, requires additional financing
SMI expects capital expenditures in 2004 and 2005 to total US$1,950
million and US$1,373 million
. For expansion of operations in Shanghai and Tianjin and
. To complete the construction, equipping and ramp-up of Fab 4, Fab 5
and Fab 6C in Beijing.
. Operating cash flows are insufficient to meet capital expenditure
requirements.
Use of IPO proceeds
> $1 billion to SMI
. US$403.0 million of the net proceeds for constructing and ramping up
Beijing fabs
. US$600 million of the net proceeds for upgrading the technology and
increasing the capacity at
Shanghai and Tianjin fabs.
> $679 mm to selling 55 shareholders, including Motorola* (will own
7.8% post IPO, down from
11.4% pre IPO), Singapore government (less than 1% pre IPO), General
Motors (less than 1%
pre IPO) and 52 others
*SMI acquired a fabrication plan from Motorola in January 2004
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Shareholder
Profile
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(Post March 11, 2004 IPO)
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Shanghai Industrial Holdings Limited
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10%
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Motorola, Inc. and Motorola (China) Electronics
Limited
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7.8%
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Global Growth Fund and International Equity
Income Fund
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5.8%
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Beijing Beida Jade Bird
Software System Company
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4.8%
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All directors and executive
officers as a group (17 persons)
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45%
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Note: This table depicts
beneficial ownership as determined in accordance with the rules of the
SEC; some of the shares may be double counted.
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Balance Sheet
on December 31, 2003
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(in $000s)
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Cash & equivalents
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445
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Notes payable
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250
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Other current assets
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236
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Current liabilities
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325
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Total current assets
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680
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Long term liabilities
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480
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Property & equipment, net
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1,523
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Total liabilities
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4,25
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Other assets, net
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87
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Shareholders’ equity
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1,485
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Total assets
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2,290
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Total liabilities & equity
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2,290
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After the March 11 IPO the
company received $1 billion, $400 million for ramping up the Beijing
fabs; $600 for upgrading the technology and increasing the capacity at
the Shanghai and Tianjin fabs
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Operating Results
and valuation ratios
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December 31 fiscal
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2001
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2002
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2003
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Mkt
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Gross Revenues (mm)
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0.0
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50
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366
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Cap (mm)
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Gross Margin %
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n/a
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-54.9%
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2.3%
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$6,006
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R&D
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9.3
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38
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32
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@$16.5
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Net Income
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-2.7
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-103
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-66
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Net Income %
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n/a
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-204%
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-18%
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Last 4 quarters
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March
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June
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Sept
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Dec
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Revenues (mm)
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38
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75
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107
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145
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Gross Margin %
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-65.2%
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-17.9%
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9.7%
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21.2%
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Net Income
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-38.3
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-27.9
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-11.1
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4.6
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Net Income %
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-100%
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-37%
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-10.4%
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3.2%
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Business Mix %
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Memory Wafers
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72%
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53%
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34%
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25%
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Logic Wafers
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24%
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43%
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60%
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72%
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Notice the increased Logic Wafer trend
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VALUATION RATIOS
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Mrkt
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Price /
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Price /
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Price /
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Price /
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Cap (mm)
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Sales
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Earnings
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BookValue
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TangibleBV
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SemiconductorMfgSMI
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6006
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10.4
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326
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2.1
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2.2
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(sales and earnings ratios based on
annualizing the most recent quarter's results
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Compare and contrast:
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The last companies from this industry sector
(Standard Industrial Classification Code: 3674)
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to go public are listed below, and the
underlying industry index:
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AMIS Holdgs (AMIS)
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Mrkt
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Price /
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Price /
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Price /
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Price /
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Price
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Cap (mm)
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Sales
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Earnings
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BookValue
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TangibleBV
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3-5-04
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1430
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2.9
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105
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7.5
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8.7
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17.50
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AMIS Holdings (Nasdaq: AMIS), a Pocatello,
Idaho-based
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manufacturer of integrated mixed signal
semiconductor products,
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priced its IPO at $20 a share on Sept. 23,
2004. The stock closed
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on Friday March 5, 2004 at $17.50 a share --
down 12.55 percent
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from its initial offering price.
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The Stock:
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Estimated Consensus EPS:
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52-week Price Range:
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Dec./2004E: $0.69
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High: $21.85 Low: $16.42 Recent: $17.50
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Dec./2005E: $0.92
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Number of brokers following the company: 7
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Dec./2006E: $0.87
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Average rating: "Buy"
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Average price target: $25 a share
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Atheros Comm ATHR
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Mrkt
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Price /
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Price /
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Price /
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Price /
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Price
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Cap (mm)
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Sales
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Earnings
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BookValue
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TangibleBV
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3-5-04
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851
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5.7
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-942
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6.2
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6.2
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18.73
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Atheros Communications (Nasdaq: ATHR), a
Sunnyvale,
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California-based developer of semiconductor
system solutions
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for wireless communications products, priced
its IPO at $14 a
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share on Feb. 11, 2004. The stock closed on
Friday March 5, 2004,
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at $18.73 a share -- up 33.8 percent from its
initial offering price.
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The Stock:
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ATHR is in its 40-day quiet period
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52-week Price Range:
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High: $19.48 Low: $17 Recent: $18.73
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Number of brokers following the company: None
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StaktekHldgs(STAK)*
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Mrkt
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Price /
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Price /
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Price /
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Price /
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Price
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Cap (mm)
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Sales
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Earnings
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BookValue
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TangibleBV
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3-5-04
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690
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11
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22
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5.8
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11.6
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13.69
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* STAK: exclude $14.7 in amortization of
compensation and acquisition expense for the Dec quarter,
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and uses a 33% tax rate (the average os 2001
and 2002)
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Staktex Holdings (Nasdaq: STAK), an Austin,
Texas-based
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provider of memory stacking solutions, priced
its IPO at $13
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a share on Feb. 5, 2004. The stock closed on
Friday March 5, 2004,
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at $13.69 a share -- up 5.3 percent from its
initial offering price.
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The Stock:
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STAK is in its 40-day quiet period
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52-week Price Range:
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High: $15.61 Low: $12.37 Recent: $13.69
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Number of brokers following the company: None
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Ratio comparison summary -- based on
annualizing last reported quarter's results
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NAME/symbol
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Mrkt
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Price /
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Price /
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Price /
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Price /
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Price
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Cap (mm)
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Sales
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Earnings
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BookValue
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TangibleBV
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3-5-04
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AMIS Holdgs (AMIS)
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1430
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2.9
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105
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7.5
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8.7
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17.50
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Atheros Comm ATHR
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851
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5.7
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-942
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6.2
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6.2
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18.73
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StaktekHoldgs(STAK)*
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690
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11
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22
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5.8
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11.6
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13.69
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Semicndctr MfgSMI
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6006
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10.4
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326
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2.1
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2.2
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24%
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* STAK: exclude $14.7 in amortization of
compensation and acquisition expense for the Dec quarter,
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and uses a 33% tax rate (the average os 2001
and 2002)
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Notice that SMI is slightly profitable
and sells at the lowest price-to-book ratio
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Ratio comparison summary --
based on annualizing last reported quarter's results
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verus the major publicly
held semiconductor foundries
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NAME/symbol
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Mrkt
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Price /
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Price /
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Price /
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Price /
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Cap (mm)
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Sales
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Earnings
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BookValue
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TangibleBV
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CharteredSemi (CHRT)
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2470
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3.4
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-88
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1.4
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1.4
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Taiwan Semi (TSM)
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43530
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8.4
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81
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4.6
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6.0
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United Micro (UMC)
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17730
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6
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36
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1.8
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2.6
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Semicndctr MfgSMI
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6006
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10.4
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326
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2.1
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2.2
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DJ Semiconductors Index:
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52-Week Percentage Change:
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52-week high: 1,608.08 (1/12/04)
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Semiconductors Index: up 82.4 percent
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52-week low: 754.57 (3/11/03)
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Nasdaq Composite: up 57.2 percent
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Dec. 31, 2002: 758.77
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Dec. 31, 2003: 1,471.32
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Recent: 1,430.25 (3/5/04)
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Management
Richard Ru Gin Chang founded the company in
April 2000 and is currently the Chairman of our Board, President and
Chief Executive Officer. Dr. Chang is also a director of SMIC Shanghai,
SMIC Beijing and SMIC Tianjin. Dr. Chang has over 25 years of
semiconductor experience in foundry operations, wafer fabrication and
research and development. From 1998 to 1999, Dr. Chang was President of
Worldwide Semiconductor Manufacturing Corp., or WSMC, after joining the
company in 1997. Prior to joining WSMC, Dr. Chang worked for 20 years
at Texas Instruments Incorporated, where he helped build and manage the
technology development and operations of ten semiconductor fabs and
integrated circuit operations in the United States, Japan, Singapore,
Italy and Taiwan. Dr. Chang received a PhD in Electrical Engineering
from Southern Methodist University and a master’s degree in Engineering
Science from the State University of New York. In December 2003, Dr.
Chang was selected by the China Center of Information Development as
one of the ten "China IT Economic People of 2003" for his role in
influencing and contributing to the development of China’s information
technology industry.
Jenny Wang joined as Chief Financial Officer
and Chief Accounting Officer in January 2004. Ms. Wang has over 25
years of experience in the investment and finance field, more than 10
of which were spent in the information technology industry. Before
joining our company, Ms. Wang worked at Motorola, where she was
Corporate Vice President and Vice President and Director of Corporate
Finance of Motorola China. Prior to that, she held the position of
Chief Representative of Motorola China with responsibilities that
included strategic planning, corporate governance, communication and
public affairs for Motorola China. She is a member of the American
Institute of Certified Public Accountants (AICPA) and the Texas Society
of Certified Public Accountants (TSCPA). Ms. Wang obtained an M.S. in
Accountancy from the University of Houston.
Marco Mora joined in 2000 as Vice President of
Operations and since November 2003 has been Chief Operating Officer.
Mr. Mora has more than 18 years of experience in the semiconductor
industry. Prior to joining, Mr. Mora held management positions with
STMicroelectronics N.V., Texas Instruments Italia S.p.A, Micron
Technology Italia S.p.A and WSMC. Mr. Mora received a master’s degree
in Physics from the University of Milan.
Toshiaki Ikoma joined as Chief Technology
Officer in January 2004. Dr. Ikoma has extensive semiconductor
experience in both academia and industry. Dr. Ikoma was the President
of Texas Instruments Japan, Inc. for five years and, prior to that
position, served as a professor of Electronics at the Institute of
Industrial Science at the University of Tokyo from 1968 to 1994. Prior
to joining, he was a professor of Technology Management at the Graduate
School of International Corporate Strategy of Hitotsubashi University,
Tokyo, beginning in 2002. Dr. Ikoma received a PhD in Electronics from
the University of Tokyo.
Akio Kawabata joined in 2002 and is currently
our Vice President of Marketing. Mr. Kawabata has over 32 years of
experience in the semiconductor industry. Prior to joining, Mr.
Kawabata held various management positions with Toshiba Corporation,
including General Manager of Toshiba’s International Division,
President of Toshiba Electronics Europe GmbH and Managing Director of
Toshiba Asia Pacific. Mr. Kawabata received a master’s degree in
Electrical Engineering from Stanford University.
Jason Ting Chih Hsien joined in
January 2002 and became our Vice President for Human Resources and
General Affairs in January 2004. He previously served as our Senior
Director of sales and marketing. Prior to joining, Dr. Ting served as a
Director of Walsin Lihwa Corporation in Taiwan. Dr. Ting received a PhD
in Material Science from the University of Illinois.
Glossary
Integrated circuit
An electronic circuit where all the elements of the
circuit are integrated together on a single
semiconductor substrate.
Logic device
A device that contains digital integrated circuits that perform a
function rather than store information.
Memory
A device that can store information for later retrieval
Semiconductor
An element with an electrical resistivity within the range of an
insulator and a conductor. A
semiconductor can conduct or block the flow of electric current
depending on the direction and
magnitude of applied electrical biases.
System-on-chip
A chip that incorporates functions usually performed by several
different devices and therefore
generally offers better performance and lower cost.
Wafer
A thin, round, flat piece of silicon that is the base of most
integrated circuits
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